Samsung Electronics, a global leader in advanced memory technology, has commenced mass production of the industry’s thinnest 12 nanometer (nm)-class LPDDR5X DRAM packages, available in 12GB and 16GB sizes. This move reinforces Samsung’s dominance in the low-power DRAM market.
Utilizing its extensive expertise in chip packaging, Samsung has developed ultra-slim LPDDR5X DRAM packages that create additional space within mobile devices, enhancing airflow and simplifying thermal control. This is particularly critical for high-performance applications with advanced features like on-device AI.
“Samsung’s LPDDR5X DRAM sets a new benchmark for high-performance on-device AI solutions, providing not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. “We are dedicated to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”
The new LPDDR5X DRAM packages feature the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing thickness by approximately 9% and improving heat resistance by about 21.2% compared to the previous generation.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, Samsung has achieved a package thickness of just 0.65 millimeters (mm), making it as thin as a fingernail. The optimized back-lapping process is also used to minimize the package height.
Samsung plans to further expand the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers and mobile device manufacturers. As the demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, Samsung intends to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.
