Apple is reportedly set to introduce its own Wi-Fi and Bluetooth chip with the iPhone 17 series, according to TF Securities International analyst Ming-Chi Kuo. This development aligns with Apple’s ongoing effort to reduce its reliance on suppliers like Broadcom by designing more components in-house. Apple’s new Wi-Fi and Bluetooth chip, expected to debut with the iPhone 17 lineup in the second half of 2025, is also rumored to support the latest Wi-Fi 7 standard and be built on TSMC’s 7nm process.
In a recent post on X (formerly Twitter), Kuo noted Apple’s goal to significantly cut its dependence on Broadcom, which currently supplies over 300 million Wi-Fi and Bluetooth chips used across Apple’s product range. The iPhone 17 series is expected to be the first model featuring Apple’s custom chip, but the company is likely to roll out this component to additional devices.
In addition to the Wi-Fi and Bluetooth chip, Apple is working on a custom 5G modem that may first appear in the fourth-generation iPhone SE, also anticipated in 2025. However, this model will still use a Broadcom chip for Wi-Fi and Bluetooth connectivity. Kuo indicates that Apple’s Wi-Fi, Bluetooth, and 5G chips are distinct products manufactured using different TSMC processes, which could lead to a phased integration across devices. Apple aims to have its proprietary chips in nearly all of its products within the next three years.
